High Performance Stepper for the most advanced packaging technology
PLAY VIDEO:
PPS-8300
Wafer Stepper
Applications
- 2.5D, 3D Package
- Interposer
- CIS / LED
- MEMS
- TSV
- WL-CSP/FO-WLP
- IGBT
- Bumping
Features
- Variable Lens NA and 1:1 Dyson type Optical System
- Large Exposure Field : 52x33mm²
- User Friendly Reticle Design (max.8 fields)
- Outgas Protection Unit for Optics
- Handling System for thin Wafer, TAIKO Wafer and warped wafer
Options
- Backside Alignment
- Exposure/Non-Exposure Function for Wafer Edge
