Direct Imaging System for high-end circuit patterning
FDi series is a top-of-the-line Direct Imaging System, first available in the market to accommodate super-fine pitch patterning requirements, which has been ever deemed unfeasible by conventional direct imaging.
- Super-fine pitch patterning is now available by FDi series, with ORCʼs unique alignment technologies; as required for high-end FC-BGA, next generation FC-CSP (such as ETS), Multi-chip module package (or SiP),
also extended to FO-PLP
- Suitable imaging mode, as selected, allows not only current HVM but also few years future products DOE and/or HVM.
- As options, FDi-MP can be configured as or built with R2R system, EFEM system or manual operation system.